Packaging Research Conclave on 17-18 March 2023

Asian Packaging Congress Seminar hosted by the Indian Institute of Packaging is all set to begin at Eros Hotel, Delhi.

23 Feb 2023 | 1558 Views | By Disha Chakraborty

The objective of the two-day Asian Packaging Congress is to highlight the latest trends and technologies of packaging materials, conversion technologies, packaging machines with automation to increase productivity and to reduce wastage and also to meet the requirement of the packaging user industry to satisfy the demands of modem consumers. Various topics in this context will be covered by the galleria of speakers from India and overseas

The theme of the conference is Packaging 3S (Safe, Secure, Sustainable). The theme was chosen by considering the fact that packaging plays a vital role in the growth of the economy of the country. The economic growth of the country is affected by the packaging industry in terms of high volume of production of packaging raw materials, its conversion into different forms of packaging and the usage of different forms of packaging by the industries with the help of innovative packaging machinery. 

The event will also feature a research conclave running concurrently. The objective of the research conclave is to encourage students and researchers at the universities.

The scientists who have developed the innovative packaging materials and systems through packaging systems will be invited to make their presentations during this research conclave..The Organisers said this will motivate young researchers to enhance the credibility of research in the field of packaging.

There will also be a poster session on research papers where the students from different universities and also from the colleges involved in food technology, polymer technology,  printing technology, packaging design and many others will be participating by displaying posters.

Prominent experts from the industry, who have agreed to speak during the conference include RK Mishra, director, IIP; Jeevaraj Pillai, joint-president, packaging, UFlex; Sunil Jain, vice-chairman, IIP; Sunil Kumar, technical manager and business development, W&H; Venkat Raman, vice-president, ITC; Swaminathan, CEO, GS1; and Utsab Chaudhury, DIC. 

Moreover, experts such as Rajesh Khosla, AGI Glass; Sanjay Chattopadhyay, convener, advisory forum, Ministry of Chemical & Fertilisers GOI; Amit Kale, vice-president, Reliance; Jatin Takkar, head product safety and regulatory, Siegwerk; and Rakesh Shah, former chairman, IIP Delhi will explore topics like trends in packaging and sustainable packaging materials, safety packaging, and recent advancements in packaging technologies.
 

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